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Wet etching of gold on graphene for high-quality resist-free graphene surfaces

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Author
Kunc, JanORCiD Profile - 0000-0001-8197-0890WoS Profile - E-6436-2013Scopus Profile - 16316320900
Shestopalov, MykhailoORCiD Profile - 0000-0003-4109-3197WoS Profile - JVN-5031-2024Scopus Profile - 57741492900
Jo, J.
Park, K.

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Publication date
2023
Published in
Nano Express
Volume / Issue
4 (3)
ISBN / ISSN
ISSN: 2632-959X
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  • Faculty of Mathematics and Physics

This publication has a published version with DOI 10.1088/2632-959X/acef45

Abstract
Wet etching of gold on graphene is challenging due to the weak adhesion of the resist mask to graphene. We report an operating procedure for alkali ion-free wet etching of gold on graphene using a mixture of hydrochloric and nitric acids (aqua regia) with a high lateral resolution down to 100 nm. We investigate the role of positive and negative resists, electron beam lithography (EBL) dose, hard-bake, oxygen etching, aging, and sensitivity to the etch parameters, such as the freshness of dilute aqua regia, etch time, and the order of etched samples. The negative-tone resist provides the best results. The over-dosed EBL exposure can enhance the resist adhesion, as hard-bake below the glass-transition temperature and well-defined wet etch of the resist-residua-free gold surface. We also present a cleaning procedure to avoid bubble formation after the hard bake. Our results demonstrate that wet etching of gold on graphene using aqua regia is a viable method for achieving high-quality resist-free graphene surfaces. This method has potential applications in graphene nanoelectronics and nanophotonics, where high-quality graphene surfaces are essential for device performance.
Keywords
wet etching of gold on graphene, over-exposure, hard-bake, post-development bake, aqua regia wet etch, bubble formation and elimination, resist adhesion enhancement
Permanent link
https://hdl.handle.net/20.500.14178/2344
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WOS:001057452200001
SCOPUS:2-s2.0-85169977970
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Full text of this result is licensed under: Creative Commons Uveďte původ 4.0 International

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